Contact
Email: jwlai(at)stanford.edu \\ jwlai(at)ee.cuhk.edu.hk
Google Scholar: Jiewen Lai
Bio
I am a Visiting Assistant Professor in the Department of Mechanical Engineering at Stanford for Spring Quarter 2026. I am also a Research Assistant Professor in the Department of Electronic Engineering at The Chinese University of Hong Kong (CUHK). I got my PhD in Mechanical Engineering from The Hong Kong Polytechnic University in 2022 and completed my postdoctoral training at CUHK in 2023.
I am interested in soft and bioinspired robotic systems, with a specific focus on compliant mechanisms, modeling, mechatronics, sensorimotor control, and robophysical intelligence for biomedical applications. My primary work has been published in venues including Nat. Rev. Electr. Eng., Nat. Commun., IJRR, T‑MECH, RA‑L, and ICRA, among others. I have been serving as an Associate Editor for ICRA since 2023.
Outside of academia, I enjoy working out. Stanford AOERC Gym is one of the best gyms I've ever been to!